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DRAM DDR3
RDIMM
 
DDR3 is the current mainstream dram technology standardized by JEDEC, bringing further improvements in power consumption and increased bandwidth over DDR2. Available in power supply voltages of 1.5V (DDR3) and 1.35V (DDR3L) and with transfer data rates from 800Mb/s to 1.6Gb/s and beyond, DDR3 has become the de facto mainstream memory technology especially for server and notebook applications in the 1H of 2010. Many other applications are available in the market today to take advantage of the superior performance features of DDR3 and DDR3L. Wintec currently offers following DDR3 and DDR3L Modules and will continue to add more solutions as DDR3/DDR3L enabled applications will proliferate.
 
DDR3 240-Pin Registered-ECC DIMMs
Standard Profile (1.181”) with Nominal Voltage (1.5V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3RE01GX809-xxxxx-yyz 1 rank 128x72 128Mx8 1.5V
2GB WD3RE02GX818-xxxxx-yyz 2 rank 256x72 128Mx8 1.5V
WD3RE02GX809-xxxxx-yyz 1 rank 256x72 256Mx8 1.5V
WD3RE02GX418-xxxxx-yyz 1 rank 256x72 256Mx4 1.5V
4GB WD3RE04GX418-xxxxx-yyz 1 rank 512x72 512Mx4 1.5V
WD3RE04GX818-xxxxx-yyz 2 rank 512x72 256Mx8 1.5V
WD3RE04GX436-xxxxx-yyz 2 rank 512x72 256Mx4 1.5V
8GB WD3RE08GX436-xxxxx-yyz 2 rank 1024x72 512Mx4 1.5V
WD3RE08GX836-xxxxx-yyz 4 rank 1024x72 256Mx8 1.5V
WD3RE08GX418-xxxxx-yyz 1 rank 1024x72 1024Mx4 1.5V
Very Low Profile (0.72”) with Nominal Voltage (1.5V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3RE01GX809V-xxxxx-yyz 1 rank 128x72 128Mx8 1.5V
2GB WD3RE02GX818V-xxxxx-yyz 2 rank 256x72 128Mx8 1.5V
WD3RE02GX809V-xxxxx-yyz 1 rank 256x72 256Mx8 1.5V
WD3RE02GX418V-xxxxx-yyz 1 rank 256x72 256Mx4 1.5V
4GB WD3RE04GX418V-xxxxx-yyz 1 rank 512x72 512Mx4 1.5V
WD3RE04GX818V-xxxxx-yyz 2 rank 512x72 256Mx8 1.5V
8GB WD3RE08GX418V-xxxxx-yyz 1 rank 1024x72 1024Mx4 1.5V
Standard Profile (1.181”) with Low Voltage (1.35V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3LE01GX809-xxxxx-yyz 1 rank 128x72 128Mx8 1.35V
2GB WD3LE02GX818-xxxxx-yyz 2 rank 256x72 128Mx8 1.35V
WD3LE02GX809-xxxxx-yyz 1 rank 256x72 256Mx8 1.35V
WD3LE02GX418-xxxxx-yyz 1 rank 256x72 256Mx4 1.35V
4GB WD3LE04GX418-xxxxx-yyz 1 rank 512x72 512Mx4 1.35V
WD3LE04GX818-xxxxx-yyz 2 rank 512x72 256Mx4 1.35V
WD3LE04GX436-xxxxx-yyz 2 rank 512x72 256Mx4 1.35V
8GB WD3LE08GX436-xxxxx-yyz 2 rank 1024x72 512Mx4 1.35V
WD3LE08GX836-xxxxx-yyz 4 rank 1024x72 256Mx8 1.35V
WD3LE08GX418-xxxxx-yyz 1 rank 1024x72 1024Mx4 1.35V
Very Low Profile (0.72”) with Low Voltage (1.35V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3LE01GX809V-xxxxx-yyz 1 rank 128x72 128Mx8 1.35V
2GB WD3LE02GX818V-xxxxx-yyz 2 rank 256x72 128Mx8 1.35V
WD3LE02GX809V-xxxxx-yyz 1 rank 256x72 256Mx8 1.35V
WD3LE02GX418V-xxxxx-yyz 1 rank 256x72 256Mx4 1.35V
4GB WD3LE04GX418V-xxxxx-yyz 1 rank 512x72 512Mx4 1.35V
WD3LE04GX418V-xxxxx-yyz 2 rank 512x72 256Mx4 1.35V
8GB WD3LE08GX418V-xxxxx-yyz 1 rank 1024x72 1024Mx4 1.35V
 
(xxxxx) =




(yy) =




(z) =
Module speed (MHz) and Cas Latency
1066J : 1066MHz CL 7
1333L : 1333Mhz CL9
1600N :1600MHz CL11

DRAM Manufacturer and Die Revision
P: Samsung
H: Micron
C: Hynix     
A: A-Die
B: B-Die
C: C-Die

Buffer / Register set (Only applies to Registered/Buffered modules)
I: Inphi
D: IDT
L: Intel
 
 
 
 
 
 
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