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DRAM DDR3
Mini - DIMM
 
DDR3 is the current mainstream dram technology standardized by JEDEC, bringing further improvements in power consumption and increased bandwidth over DDR2. Available in power supply voltages of 1.5V (DDR3) and 1.35V (DDR3L) and with transfer data rates from 800Mb/s to 1.6Gb/s and beyond, DDR3 has become the de facto mainstream memory technology especially for server and notebook applications in the 1H of 2010. Many other applications are available in the market today to take advantage of the superior performance features of DDR3 and DDR3L. Wintec currently offers following DDR3 and DDR3L Modules and will continue to add more solutions as DDR3/DDR3L enabled applications will proliferate.
 
DDR3 - 244-Pin MiniDIMM - Registered ECC
Standard Profile (1.181”) with Nominal Voltage (1.5V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3NE01GX809-xxxxx-yyz 1 rank 128x72 128Mx8 1.5V
2GB WD3NE02GX809-xxxxx-yyz 1 rank 256x72 256Mx8 1.5V
4GB WD3NE04GX809-xxxxx-yyz 1 rank 512x72 512Mx8 1.5V
Very Low Profile (0.72”) with Nominal Voltage (1.5V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3NE01GX809V-xxxxx-yyz 1 rank 128x72 128Mx8 1.5V
2GB WD3NE02GX809V-xxxxx-yyz 1 rank 256x72 256Mx8 1.5V
4GB WD3NE04GX818V-xxxxx-yyz 2 rank 512x72 256Mx8 1.5V
WD3NE04GX809V-xxxxx-yyz 1 rank 512x72 512Mx8 1.5V
DDR3 - 244-Pin MiniDIMM - Unbuffered ECC
Standard Profile (1.181”) with Nominal Voltage (1.5V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3OE01GX809-xxxxx-yy 1 rank 128x72 128Mx8 1.5V
2GB WD3OE02GX809-xxxxx-yy 1 rank 256x72 256Mx8 1.5V
4GB WD3OE04GX809-xxxxx-yy 1 rank 512x72 512Mx8 1.5V
8GB WD3OE08GX809-xxxxx-yy 1 rank 1024x72 1024Mx8 1.5V
Very Low Profile (0.72”) with Nominal Voltage (1.5V)
Density Part Number Rank DIMM
Config
Component
Config
Voltage
1GB WD3OE01GX809V-xxxxx-yy 1 rank 128x72 128Mx8 1.5V
2GB WD3OE02GX809V-xxxxx-yy 1 rank 256x72 256Mx8 1.5V
4GB WD3OE04GX809V-xxxxx-yy 1 rank 512x72 512Mx8 1.5V
8GB WD3OE08GX809V-xxxxx-yy 1 rank 1024x72 1024Mx8 1.5V
 
(xxxxx) =




(yy) =




(z) =
Module speed (MHz) and Cas Latency
1066J : 1066MHz CL 7
1333L : 1333Mhz CL9
1600N :1600MHz CL11

DRAM Manufacturer and Die Revision
P: Samsung
H: Micron
C: Hynix     
A: A-Die
B: B-Die
C: C-Die

Buffer / Register set (Only applies to Registered/Buffered modules)
I: Inphi
D: IDT
L: Intel
 
 
 
 
 
 
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